Reclaimed Wafers are made from recycled dummy wafers and test wafers to lower the budget of test wafers. Abocom provides professional front and back lapping and polishing services.

Service -

Professional grinding and thinning process (e.g. MOSFET, IGBT procedures).

Wafer Reclaiming (Lapping and polishing)

Developing CMP consumables

In-House wafer reclaiming procedure outsource

developing wafer lapping equipment

Abocom’s Wafer Reclaiming Procedures

In our process of wafer reclaiming, flexible resin is covered on the abrasive for lapping, using very low down-force to remove physically the filter on the wafer. The procedure is more environmental friendly and reduces the silicon removal and the damaged zone.

Efficient as the lapping process is, it creates an even surface on the wafer and also enables the chemical mechanical polish procedure to make further polishing until it becomes mirror-like.

Compared to the slurry used in typical lapping procedures, Abocom’s lapping procedure reduces greatly the removal of silicon and increases the reusability of the wafer. Furthermore, the mechanical polish procedure increases the yield and is much less costly.

Back Matte

Front Polish